Thermally conductive poly(ether ether ketone)/boron nitride composites with low coefficient of thermal expansion
نویسندگان
چکیده
Abstract The substantial heat generation due to miniaturization and high-degree integration of electronic devices is one the major issues facilitate efficient thermal management in power electronics. Though epoxy-based composites have shown great interest different applications such as laminated circuit board, component encapsulations, potting, they low application temperature (up 150 °C) higher mismatch coefficient expansion (CTE) between source sink. Here, poly(ether ether ketone) (PEEK) reinforced with hexagonal boron nitride (hBN) nanoplatelets been developed by liquid mixing re-melting method for a step change composite materials lower CTE significantly improved dissipation capability. lowest achieved 2.1 µm m ?1 K , highest conductivity 1.04 W PEEK/hBN at 30 wt% hybrid hBN content (hBN platelets two sizes, i.e. 70 nm 500 nm, taken 1:1 weight ratio), formation thermally conductive inter-filler networks. show negligible variation working up 250 °C. also exhibit excellent electrical insulation properties; thus, will good potential applications. Graphical abstract
منابع مشابه
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ژورنال
عنوان ژورنال: Journal of Materials Science
سال: 2021
ISSN: ['1573-4803', '0022-2461']
DOI: https://doi.org/10.1007/s10853-021-05923-0